Apparatus and method for shear testing bonds of electrical connections

Abstract

A device is described for testing the force to shear a deposit of solder or gold from a substrate, these deposits having a diameter in the range 50-100 μm and being for the bonding of electrical conductors. A shear tool has a semi-cylindrical cavity which closely approximates to the mean diameter of a range of substrates. This tool is adapted to re-shape substrates for a better fit, re-shaping occurring over 30% or less of the circumference of a deposit, and to a depth of 10% or less of the diameter of the substrate.

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