Method and apparatus for chemical-mechanical polishing

Abstract

A method for chemical-mechanical polishing of a layer that is deposited on a surface of an integrated circuit substrate is described. The method includes: (1) immobilizing the integrated circuit substrate using a substrate holder such that the integrated circuit substrate surface is positioned against a surface of a polishing pad, which is mounted on a supporting surface; (2) a first stage of polishing the substrate surface including maintaining a predetermined difference between the rotational velocity of the polishing pad and the rotational velocity of the substrate holder allowing an endpoint of the chemical-mechanical polishing process of the layer to be detected; and (3) a second stage of polishing the substrate such that the rotational velocity of the polishing pad and the rotational velocity of the substrate holder are substantially the same to produce a substantially planar substrate surface.

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