US 6,336,601 B1 · Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment

Abstract

A method for treating waste printed circuit boards, the method has the steps of: heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher; pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; and separating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.

Claims0

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Facts

Application

09/458,845Filed 13 Dec 1999

Granted

8 Jan 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification32 codes

C22B 7/005
Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or…:…
B09B 3/35
Involving mechanical treatment: shredding, crushing or cutting
B29B 17/02
Recovery of plastics or other constituents of waste material containing plastics: separating plastics from other materials
C22B 7/001
Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or…: dry…

Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment

Life of this patent

Abstract

Claims0

Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment

Life of this patent

Abstract

Claims0