Thermal print head

Abstract

The object is to provide a thermal print head that can absorb an expansion due to difference of thermal expansion coefficients of a ceramic substrate and a glass-epoxy based printed circuit board to enable to obtain excellent printing quality, to be high in reliability, and to be capable of downsizing. For this, a thermal print head is constituted to comprise a base provided with heat-generating resistors, a printed circuit board disposed in close proximity to the base, a semiconductor element for driving that is mounted on the base or the printed circuit board and electrically connected to the base and the printed circuit board, and a sealing-member that seals the semiconductor element for driving and includes a hard seal portion consisting of hard sealing-material and a soft seal portion consisting of soft sealing-material more flexible than the hard sealing-material, wherein the hard seal portion is disposed on the base, and the soft seal portion is disposed extended on the base and the printed circuit board.

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