Apparatus and method for testing an electronics package substrate

Abstract

An apparatus for testing an electrical connection between a first electrical contact on a first side of an electronics package substrate and a first electrical terminal on a second, opposing side of the substrate. A holder is provided which is capable of releasably receiving and holding a substrate. At least a first electrical pin is located on the holder. The first electrical pin is positioned to contact the first electrical contact on the first side of the substrate. A support structure is mounted to the holder. An electrical probe is mounted to the support structure. The electrical probe is movable relatively to the support structure between a first position and a second position. In the first position the electrical probe is distant from the first electrical terminal on the second side of the substrate. In the second position the electrical probe is in contact with the first electrical terminal.

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