Pipe handling system for laser and other pipe treating processes

Abstract

The invention provides a pipe handling system which can transform a flat XY cutting system into a pipe cutting system which maintains very accurate pipe positions for laser, plasma, mechanical or other material processes, regardless of distortions in the pipe. The invention also provides a pipe handling system which can accommodate longer pipes, and a large range of pipe diameters. The pipe handling system is simpler, lighter and much more economical than conventional pipe handling systems.

Claims aren’t available for this document.