Thermopile infrared sensor, thermopile infrared sensors array, and method of manufacturing the same

Abstract

A thermopile infrared sensor includes a substrate, at least one thermocouple cantilever beam comprising at least one thermocouple, and a suspending membrane. The cantilever beam is formed above the substrate. The cantilever beam has a first end and a second end located away from the first end. The first end is attached to the substrate to form a cold junction. A predetermined distance is formed between the second end and the substrate. The suspending membrane is formed above the cantilever beam and is supported by the second end of the cantilever beam to form a hot junction. The cantilever beam is completely hidden underneath or covered by the suspending membrane. In addition, an integrated circuit, which is underneath the suspending membrane, can be integrated with the thermopile infrared sensor.

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