US 6,335,298 B1 · Insulating glass paste and thick-film circuit component

Abstract

Disclosed is an insulating glass paste capable of forming an over glaze layer having a low rate of occurrence of cracks and excellent reliability. The insulating glass paste is used for forming an over glaze layer on an insulating substrate exhibits a fracture toughness strength of about 1.0 MN/m{fraction (3/2)} or more after burning.

Claims0

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Claims aren’t available for this document.

Facts

Application

09/459,828Filed 13 Dec 1999

Granted

1 Jan 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

C03C 8/14
Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions: glass frit mixtures having non-frit additions, e.g.…
H05K 1/0306
Use of materials for the substrate: inorganic insulating substrates, e.g. ceramic, glass
H05K 3/28
Secondary treatment of printed circuits: applying non-metallic protective coatings
H05K 3/4667
Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes,…

Insulating glass paste and thick-film circuit component

Life of this patent

Abstract

Claims0

Insulating glass paste and thick-film circuit component

Life of this patent

Abstract

Claims0