Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same

Abstract

As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder coated with a resin which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-holes produces a monolithic ceramic. Filling characteristics of the electrically conductive paste into via-holes are improved, and cracks and elevations of the conductive metal and cracks of the ceramic barely form during the baking step. Further, the resulting monolithic ceramic substrate can maintain excellent soldering wettability and plating characteristics.

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