Manufacturing method for diode group processed by injection molding on the surface

Abstract

A manufacturing method for a diode group processed by injection molding on the surface thereof, the diode group is formed by having a plurality of left and right elongate tapes which are pressed to form respectively left and right contact ends, each pair of the left and right elongate tapes have a left lap end and a right lap end to sandwich a chip therebetween. Then injection molding is performed to envelop the left and right elongate tapes and to form an elongate strip having an insulation outer layer with the left and right contact ends exposed and with a recess at the bottom of and between every two neighboring chips. The recesses separate the left contact ends of the left elongate tapes from the right contact ends of the right elongate tapes but still leave the plural diodes in series connected mutually in an insulation state. The strip can be broken off at desire recesses to get a diode group having desired number of diodes processed by injection molding on the surface of the strip.

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