Unleaded solder powder and production method therefor

Abstract

A lead-free solder in which oxidation of the powder surface with time is prevented and a process for preparing the same. The lead-free solder powder has tin-zinc or tin-zinc-bismuth as a major composition and forms an organometallic compound of malonic acid and a metal of the solder alloy powder on the surface of solder alloy powder containing no lead.

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