Nozzle reposition device used in a resist coating process

Abstract

A spray nozzle resetting device comprises a spray nozzle for spraying resist onto a midpoint of a wafer, a rotary robotic arm that has a resist-delivering duct connected to the spray nozzle, a covering nut, a resetting ring, and a fixing ring. The covering nut has an opening of diameter D. The resetting ring has a rotary part of a diameter less than or equal to D, which fits in the opening of the covering nut, and at least two protrusions. The fixing ring, having two recesses that correspond to the two protrusions and interact with them, is used to connect the covering nut and the rotary robotic arm.

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