US 6,334,567 B1 · Component and method for production thereof

Abstract

The invention relates to a component and to a method for the production. The component is an electronic component with a micro electronic chip and a carrier which is produced by means of isothermal coagulation.

Claims0

Dependent claims

Claims aren’t available for this document.

Facts

Application

09/530,273Filed 28 Apr 2000

Granted

1 Jan 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10W 99/00
Subject matter not provided for in other groups of this subclass
B23K 20/10
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating: making use of…
H10W 20/40
Interconnections in chips, wafers or substrates: interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or…
H10W 70/417
Chip-supporting parts, e.g. die pads: bonding materials between chips and die pads

Component and method for production thereof

Life of this patent

Abstract

Claims0

Component and method for production thereof

Life of this patent

Abstract

Claims0