Emi shield with connector cover extension

A Type III PCMCIA card that is sized and configured to be electronically connected to a host device, the card comprising:

• a dielectric top cover, the top cover including an inner surface and an outer surface;
• a substrate including an upper surface, a lower surface, a front end and a rear end;
• a connector attached to the front end of the substrate, the connector being sized and configured to connect the card to the host device;
• and
• a conductive panel having generally the same size and configuration as at least a portion of the inner surface of the top cover, the conductive panel being disposed between the upper surface of the substrate and the inner surface of the top cover.

A communications card comprising:

• a dielectric top cover, the top cover including an inner surface and an outer surface;
• a conductive panel disposed proximate the inner surface of the top cover, the conductive panel including an upper surface and a lower surface;
• a substrate disposed proximate the lower surface of the conductive panel, the substrate including an upper surface, a lower surface, a front end and a rear end;
• a connector attached to the front end of the substrate, the connector being sized and configured to connect the card to the host device;
• and
• a conductive lower cover panel disposed proximate the lower surface of the substrate, the conductive lower cover panel being electrically connected to the conductive panel.

A Type III PCMCIA card that is sized and configured to be electronically connected to a host device, the card comprising:

• a dielectric top cover, the top cover including an inner surface and an outer surface;
• a substrate including an upper surface, a lower surface, a front end and a rear end;
• a connector attached to the front end of the substrate, the connector being sized and configured to connect the card to the host device;
• and
• a conductive panel having generally the same size and configuration as at least a portion of the inner surface of the top cover, the conductive panel being disposed between the upper surface of the substrate and the inner surface of the top cover, the conductive panel including an extension that covers at least a portion of an upper surface of the connector;
• and
• a lower cover panel attached to the top cover, the lower cover panel being constructed of a conductive material and being electrically connected to the conductive panel;
• wherein the conductive panel and lower cover panel are electrically connected to ground when the communications card is inserted into the host device in order to decrease the electromagnetic radiation emitted by the communications card.