CPU heat dissipation device with special fins
OwnerLiken Lininventor
Life of this patent
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Abstract
The CPU heat dissipation device with special fins includes a fan sink mounted above a CPU with a plurality of fins, a fan and a cover thereof. A slot is mounted on the fan sink while a socket for mounting a fan is disposed on one side thereof. The cover is covered on the top of the fan sink. The characteristic of the device is in special fins which have different designs such as elliptic shaped, strip-shaped, foliar shape, and crescent shape. In accordance with the structure mentioned above, the velocity of airflow is increased by the high-pressure channels composed of various kinds of fins. Thus the heat dispersion rate can be improved.
Claims6
A CPU heat dissipation device with special fins comprising a fan sink being mounted above a CPU with a slot thereof, a plurality of fins being arranged inside said fan sink, a socket for mounting a fan being disposed on one side of said fan sink, a cover located on the top of said fan sink, wherein the heat generating from said CPU is absorbed by said fan sink and is dispersed by said fan;
- the present invention is characterized in that said fins on said fan sink includes elliptic fins, strip-shaped fins, and foliar fins and crescent fins that forms a plurality of high-pressure channels in order to increase the velocity of airflow.
Dependencies are inferred from the claim text.