Identification element and method of manufacturing an identification element
AssigneeMeto International GmbH
InventorRichard Altwasser
Life of this patent
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Abstract
The present invention is directed to a method and an identification element (8) comprising an integrated circuit and an antenna coil disposed on a substrate. With respect to the identification element, it is proposed that the conducting track/conducting tracks of the antenna coil be die-stamped from an aluminum foil, that terminal pads referred to as bumps projecting from the undersurface of the integrated circuit be formed on the contacts of the integrated circuit, and that at least in the area of the bumps provision is made for a substance which, as a result of a defined volume reduction occurring during curing, produces a compressive and/or tensile force between the integrated circuit and the substrate so that the bumps are connected to the antenna coil by a press contact.
Claims16
An identification element, comprising:
- a substrate;
- an integrated circuit with contacts and terminal pads formed on and projecting from said contacts;
- an antenna coil comprising at least one conducting track die-stamped from aluminum foil, having at least one turn, said antenna coil being electrically connected to said integrated circuit, said integrated circuit and said antenna coil being arranged on said substrate;
- and
- a substance situated between said integrated circuit and said substrate, which, as a result of a defined volume reduction occurring during curing, produces one of:
- a compressive force, and a tensile force so that said terminal pads are connected to said antenna coil by a press contact.
A method of manufacturing an identification element, including:
- a substrate;
- an integrated circuit with contacts and terminal pads;
- an antenna coil having at least one conducting track with at least one tun;
- and a substance, the method comprising the steps of:
- die-stamping the conducting tracks from aluminum foil;
- forming the terminal pads on the contacts to project therefrom;
- arranging the integrated circuit and the antenna coil on the substrate, and electrically connecting them;
- and
- applying, at least in the area of the terminal pads the substance which, as a result of a defined volume reduction occurring during curing, produces one of:
- a compressive force, a tensile force, and a compressive and tensile force between the integrated circuit and the substrate whereby the terminal pads are connected to the antenna coil by a press contact.
Dependencies are inferred from the claim text.