Semiconductor test apparatus and test method using the same
AssigneeFujitsu Limited
InventorsNorio Fukasawa, Yukinori Sumi
Life of this patent
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Abstract
A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate connection terminals, and an upholding substrate which has upholding parts formed to project at a position that faces the connection part and which urges, in cooperation with the test substrate, the connection parts toward the plate connection terminals of the semiconductor device so as to electrically connect the connection parts to the plate connection terminals.
Claims20
A semiconductor test apparatus for testing a semiconductor device having plate connection terminals, comprising:
- a test substrate comprising a support film and a conductive layer, said support film formed of an insulating material and said conductive layer formed on said support film and having deformable connection parts for connecting and disconnecting with said plate connection terminals;
- and
- an upholding substrate having upholding parts formed to project at a position that faces said connection parts and which urges, in cooperation with said test substrate, said connection parts toward said plate connection terminals of said semiconductor device so as to electrically connect said deformable connection parts to said plate connection terminals in a state in which said deformed connection parts are bent.
Dependencies are inferred from the claim text.