Semiconductor wafer aligning system and method using same
AssigneeSamsung Electronics Co., Ltd.
InventorJae-soon Kim
Life of this patent
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Abstract
A semiconductor wafer aligning system includes a table having a spray opening for upwardly spraying fluid to form a fluid surface on which a semiconductor wafer floats. A guide disposed on the table contacts the wafer at a circumferential edge to guide the wafer to a correct location. Thus, a wafer is aligned without generating particles that hinder semiconductor fabrication, and without directly scratching a front side during back side grinding.
Claims11
A semiconductor wafer aligning system comprising;
- a table having a spray opening for upwardly spraying a fluid to form a fluid surface on which a semiconductor wafer floats;
- and
- a guide disposed on the table, for contacting the wafer at a circumferential edge of the wafer, wherein the fluid flows horizontally after being sprayed upward, and the wafer floats horizontally on a surface of the fluid to a correct wafer location;
- wherein the guide comprises;
- a left guide for contacting the wafer along one portion of the circumferential edge of the wafer;
- a right guide for contacting the wafer along another portion of the circumferential edge of the wafer;
- and
- a drive mechanism connected to the left and right guides, disposed outside a peripheral edge of the spray opening, for varying a separation distance between the left guide and the right guide.
A semiconductor wafer aligning system comprising:
- a table having a spray opening for upwardly spraying a fluid to form a fluid surface on which a semiconductor wafer floats;
- a guide disposed on the table, for contacting the wafer at a circumferential edge of the wafer, wherein the fluid flows horizontally after being sprayed upward, and the wafer floats horizontally on a surface of the fluid to a correct wafer location;
- a sensor disposed on the guide for sensing whether the wafer is mounted and for transmitting a sensing signal corresponding to a mounted state of the wafer;
- and
- a controller in communication with the sensor, for receiving the wafer sensing signal and transmitting a guide control signal to the guide for controlling a guide movement of the guide.
A semiconductor wafer aligning system comprising:
- a table having a spray opening for upwardly a fluid to form a fluid surface on which a semiconductor wafer floats;
- a guide disposed on the table, for contacting the wafer at a circumferential edge of the wafer, wherein the fluid flows horizontally after being sprayed upward, and the wafer floats horizontally on a surface of the fluid to a correct wafer location;
- and
- a fluid circulation assembly for recirculating sprayed fluid to be reused at the spray opening;
- wherein the fluid circulation assembly comprises;
- a discharge groove formed on a top surface of the table outside the spray opening, oriented to carry the sprayed fluid in a discharge direction;
- a fluid purification apparatus in flow communication with the discharge groove, for receiving and purifying discharged fluid;
- a fluid supply apparatus in flow communication with the fluid purification apparatus for supplying purified;
- and
- a fluid source in flow communication with the fluid supply apparatus and the spray opening, for providing fluid to the spray opening.
A method of aligning a semiconductor wafer using a semiconductor wafer aligning system having a table with a spray opening and a guide mechanism, the method comprising:
- spraying a liquid through the spray opening upward toward a wafer to cause the wafer to float on a liquid surface formed by the sprayed liquid;
- and
- using the guide mechanism to guide the wafer as the liquid flows horizontally after being sprayed upward, such that the wafer floats horizontally on a surface of the liquid to a correct wafer location;
- wherein the guide mechanism includes a plurality of receptors for removably receiving protrusion members, and wherein said method further comprises inserting the protrusion members in selected ones of the receptors according to a diameter of the wafer.
Dependencies are inferred from the claim text.