US 6,333,635 B1Granted

Probe card for testing an integrated circuit chip

AssigneeSamsung Electronics Co., Ltd.

InventorsHan-shik Lee, Hoon-jung Kim

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Abstract

A probe card for use in testing at least two Quad Pad IC chips at the same time, includes a printed circuit board having an aperture extending therethrough, a plurality of pins for probing contact pads formed on the chips and electrically connected to the circuitry of the printed circuit board, a fixing ring extending around the aperture and positioning the pins relative to the test chips, and a fixing bridge traversing the fixing ring and disposed over a region between two of the test chip locations. Those pins which are for contacting the contact pads closest to the fixing ring protrude from and are supported by the sides of the fixing ring. On the other hand, the contact pads which will lie rather far from the sides of the fixing ring are probed by pins protruding from and supported by the fixing bridge.

Claims18

Dependent claims

A probe card for testing IC chips, said probe card comprising:

a printed circuit board having test circuit patterns configured to test electrical characteristics of at least two integrated circuit chips, and at least one aperture extending therethrough sized to accommodate at least two of the integrated circuit chips to be tested;
a plurality of probe pins for use in probing contact pads of the chips, said probe pins being electrically connected to the test circuit patterns of said printed circuit board, said probe pins comprising a first group of probe pins and a second group of probe pins;
a fixing ring extending around said aperture of the printed circuit board, the first group of probe pins being fixed to and protruding from said fixing ring;
and at least one fixing bridge traversing said fixing ring from one side thereof to the other, the second group of probe pins being fixed to and protruding from said fixing bridge,
wherein the first group of probe pins and the second group of probe pins contact one of the integrated circuit chips in a straight line, and
wherein the first group of probe pins comprises more than two pins.

3 more elements

Dependencies are inferred from the claim text.