Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams

A microelectromechanical structure comprising:

• a microelectronic substrate;
• a first pair of spaced-apart supports on the microelectronic substrate;
• a first arched beam that extends between the first pair of spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the first arched beam;
• a second pair of spaced-apart supports on the microelectronic substrate;
• a second arched beam that extends between the second pair of spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the second arched beam;
• a heater on the first and second arched beams that applies heat thereto and displaces therewith as the first and second arched beams displace;
• a first coupler portion on the heater having an extension therefrom;
• and
• a second coupler portion on the heater having a recess therein, the second coupler portion spaced-apart from the first coupler portion so that the extension is positioned in the recess in a non-contacting relationship therewith.

A microelectromechanical structure comprising:

• a microelectronic substrate;
• first and second spaced-apart supports on the microelectronic substrate;
• a plurality of arched beams that extend between the first and second spaced-apart supports and that expand upon application of heat thereto to thereby cause displacement of the plurality of arched beams;
• a heater on the plurality of arched beams that applies heat thereto and displaces with the plurality of arched beams as the plurality of arched beams displace;
• a first coupler portion on the heater having a plurality of extensions therefrom;
• and
• a second coupler portion on the heater having a plurality of recesses therein, the second coupler portion spaced-apart from the first coupler portion so that the plurality of extensions are positioned in the plurality of recesses in a non-contacting relationship therewith.

A microelectromechanical structure comprising:

• a microelectronic substrate;
• an anchor connected to the microelectronic substrate;
• a pair of spaced-apart movable supports on the microelectronic substrate;
• a cross-beam that extends between the pair of spaced-apart moveable supports;
• a first arched beam arched in a first predetermined direction that extends between the pair of spaced-apart movable supports and that expands upon application of heat thereto to thereby cause displacement of the first arched beam in the first predetermined direction relative to the pair of spaced-apart movable supports;
• a first heater on the first arched beam and connected to the anchor, that applies heat to the anchor and displaces with the first arched beam as the first arched beam displaces;
• and
• a second arched beam arched in a second predetermined direction that extends between the pair of spaced-apart movable supports and that expands upon application of heat thereto to thereby cause displacement of the second arched beam in the second predetermined direction relative to the pair of spaced-apart movable supports.