Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
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Abstract
A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the surface on which the passivation film is formed; an external electrodes formed on the conductive foil; intermediate layer formed between the passivation film and the conductive foil to support the conductive foil; and wires electrically connecting the electrodes to the conductive foil; wherein a depression tapered in a direction from the conductive foil to the passivation film if formed under a part of the conductive foil that includes the connection with the external electrodes.
Claims32
A semiconductor device comprising:
- a semiconductor element that includes a plurality of electrodes;
- a passivation film formed on a surface of said semiconductor element in a region avoiding at least a part of each of said electrodes;
- a conductive foil formed at a given spacing from the surface on which said passivation film is formed;
- external electrodes formed on said conductive foil;
- an intermediate layer formed between said passivation film and said conductive foil to support said conductive foil;
- and
- wires electrically connecting said electrodes to said conductive foil;
- wherein a depression opening between said conductive foil to said passivation film is formed in said intermediate layer under a part of said conductive foil that includes the connection with said external electrodes.
A method of manufacturing a semiconductor device, comprising the steps of:
- providing a semiconductor element that includes a plurality of electrodes and a passivation film that is formed on a surface of said semiconductor element in a region avoiding at least a part of each of said electrodes;
- forming a conductive foil at a given spacing from the surface on which said passivation film is formed;
- forming external electrodes on said conductive foil;
- forming an intermediate layer between said passivation film and said conductive foil to support said conductive foil;
- forming a depression opening between said conductive foil to said passivation film in said intermediate layer under a part of said conductive foil that includes the connection with said external electrodes and in a position to avoid said electrodes;
- and
- forming wires that connect electrically said electrode to said conductive foil;
- said external electrodes are formed on said conductive foil in a position above said depression.
Dependencies are inferred from the claim text.