Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes

A semiconductor device comprising:

• a semiconductor chip;
• a plurality of protrusion electrodes which function as external connecting terminals, the semiconductor device being mounted to a printed circuit board via the protrusion electrodes;
• an interposer which electrically connects the semiconductor chip to the protrusion electrodes;
• a mold resin which seals at least a part of the semiconductor chip and a part of the interposer;
• and
• a connecting portion sealing resin which seals a connecting portion between the interposer and the semiconductor chip,
• wherein a thermal expansion coefficient of the mold resin is matched to a thermal expansion coefficient of the printed circuit board,
• wherein the mold resin is provided with a side surface holding portion which holds side surfaces of the semiconductor chip so as to restrict thermal deformation of the semiconductor chip,
• wherein the semiconductor device further comprises one or more semiconductor chips besides the semiconductor chip, and
• wherein all the semiconductor chips are stacked up in the mold resin.

A semiconductor device comprising:

• a semiconductor chip;
• a plurality of protrusion electrodes which function as external connecting terminals, the semiconductor device being mounted onto a printed circuit board via the protrusion electrodes;
• an interposer which electrically connects the semiconductor chip to the protrusion electrodes;
• a mold resin which seals at least a part of the semiconductor chip and a part of the interposer;
• and
• a connecting portion sealing resin which seals a connecting portion between the interposer and the semiconductor chip,
• wherein the mold resin is elastically deformed so as to take up stress caused by a thermal expansion difference between the semiconductor chip and the printed circuit board,
• wherein the interposer is bonded to the semiconductor chip via a bonding member,
• wherein an interposing portion is formed in the bonding member, and
• wherein the mold resin is disposed in the interposed portion.

A semiconductor device comprising:

• a semiconductor chip;
• a plurality of protrusion electrodes which function as external connecting terminals, the semiconductor device being mounted onto a printed circuit board via the protrusion electrodes;
• an interposer which electrically connects the semiconductor chip to the protrusion electrodes;
• a mold resin which seals at least a part of the semiconductor chip and a part of the interposer;
• and
• a connecting portion sealing resin which seals a connecting portion between the interposer and the semiconductor chip,
• wherein the mold resin is elastically deformed so as to take up stress caused by a thermal expansion difference between the semiconductor chip and the printed circuit board,
• wherein the interposer is bonded to the semiconductor chip via a bonding member,
• wherein an interposing portion is formed in the bonding member,
• wherein the mold resin is disposed in the interposed portion,
• wherein the semiconductor device further comprises one or more semiconductor chips besides the semiconductor chip, and
• wherein all the semiconductor chips are stacked up in the mold resin.

A method of producing a semiconductor device, comprising the steps of:

• disposing bonding members in predetermined positions on one or both of a semiconductor substrate and an interposer;
• cutting the semiconductor substrate into individual semiconductor chips;
• bonding said individual semiconductor chips to the interposer via the bonding members, so that electrode pads formed on said individual semiconductor chips are electrically connected to the interposer;
• molding a mold resin in an opening between each of said individual semiconductor chips and the interposer separated by one or both of the bonding members and sides of each of said individual semiconductor chips;
• and
• collectively cutting the mold resin and the interposer to form individual semiconductor devices, each containing one of said individual semiconductor chips.

A method of producing a semiconductor device, comprising the steps of:

• disposing bonding members in predetermined positions on one or both of a semiconductor substrate and an interposer;
• cutting the semiconductor substrate into individual semiconductor chips;
• bonding said individual semiconductor chips to the interposer via the bonding members, so that electrode pads formed on said individual semiconductor chips are electrically connected to the interposer;
• molding a mold resin in an opening between each of said individual semiconductor chips and the interposer separated by one or both of the bonding members and sides of each of said individual semiconductor chips;
• and
• collectively cutting the mold resin and the interposer to form individual semiconductor devices, each containing one of said individual semiconductor chips,
• wherein the bonding members are made of an elastic material.

A method of producing a semiconductor device, comprising the steps of:

• disposing bonding members in predetermined positions on one or both of a semiconductor substrate and an interposer;
• cutting the semiconductor substrate into individual semiconductor chips;
• bonding said individual semiconductor chips to the interposer via the bonding members, so that electrode pads formed on said individual semiconductor chips are electrically connected to the interposer;
• molding a mold resin in an opening between each of said individual semiconductor chips and the interposer separated by one or both of the bonding members and sides of each of said individual semiconductor chips;
• and
• collectively cutting the mold resin and the interposer to form individual semiconductor devices, each containing one of said individual semiconductor chips,
• wherein an elastic sheet member is disposed on a surface of a cavity of a metal mold to be used in the molding step.

A method of producing a semiconductor device, comprising the steps of:

• disposing a semiconductor substrate evenly on an expandable sheet member;
• cutting only the semiconductor substrate disposed on the sheet member into individual semiconductor chips;
• expanding the sheet member so as to elongate a distance between said individual semiconductor chips;
• disposing an interposer on said individual semiconductor chips so that said individual semiconductor chips are electrically connected to the interposer;
• forming a sealing resin in a connecting position between the interposer and each of said individual semiconductor chips and sides of each of said individual semiconductor chips;
• and
• collectively cutting the sealing resin and the interposer into individual semiconductor chips, each containing one of said individual semiconductor chips.