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AssigneeInternational Business Machines Corporation
InventorsRaymond A. Jackson, Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Mukta S. Farooq, Shaji Farooq, Lewis S. Goldmann, Gregory B. Martin, Sudipta K. Ray
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The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.
An interconnect structure comprising, a substrate secured to at least one chip, at least one organic interposer secured to said substrate with at least one first interconnect, and at least one organic board secured to said at least one organic interposer using at least one second interconnect.
Dependencies are inferred from the claim text.