Multichip module having stacked chip arrangement
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChun Hung Lin
Life of this patent
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Abstract
A multichip module mainly comprises two stacked chips disposed on and respectively wire bonded to a substrate or a lead frame. There are a plurality of electrically conductive bumps having base portions and pillar protruding portions interposed between the two chips. The conductive bumps are attached at their base portions to the bonding pads of the lower chip and connected at their pillar protruding portions to the backside surface of the upper chip so as to support the upper chip. In the multichip module of the present invention, the pillar protruding portions of bumps help to provide clearance between the two chips for keeping the upper chip from damaging the bonding wires of the lower chip.
Claims15
A multichip module comprising:
- means for supporting chips, the supporting means being provided with a plurality of conductive leads;
- a first chip disposed on the supporting means, the first chip having a plurality of bonding pads formed on the active surface thereof;
- a second chip positioned over the first chip, the second chip having a plurality of bonding pads formed on the active surface thereof;
- a plurality of electrically conductive bumps having base portions and pillar protruding portions, the bumps being attached at their base portions to the bonding pads of the first chip and connected at their pillar protruding portions to the backside surface of the second chip so as to support the second chip;
- an adhesive layer interposed between the first and the second chips;
- a plurality of first bonding wires having one ends connected to the conductive leads by ball bonding and the other ends connected to the base portions of the bumps on the bonding pads of the first chip by stitch bonding;
- and
- a plurality of second bonding wires connected between the conductive leads and the bonding pads of the second chip,
- wherein the pillar protruding portions of bumps help to provide clearance between the first and second chips for the first bonding wires.
A muitichip module comprising:
- means for supporting chips, the supporting means being provided with a plurality of conductive leads;
- a first chip disposed on the supporting means, the first chip having a plurality of bonding pads formed on the active surface thereof;
- a second chip positioned over the first chip, the second chip having a plurality of bonding pads formed on the active surface thereof;
- a plurality of electrically conductive protuberances attached to the bonding pads of the first chip;
- a plurality of first bonding wires having one ends connected to the conductive leads by ball bonding and the other ends connected to the protuberances on the bonding pads of the first chip by stitch bonding;
- a plurality of electrically conductive bumps attached to the stitch bonding ends of first bonding wires and connected to the backside surface of the second chip so as to support the second chip;
- an adhesive layer interposed between the first and the second chips;
- and
- a plurality of second bonding wires connected between the conductive leads and the bonding pads of the second chip,
- wherein the conductive bumps help to provide clearance between the first and second chips for the first bonding wires.
Dependencies are inferred from the claim text.