Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate
OwnerI-Ming Cheninventor
Life of this patent
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Abstract
A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on the pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region. Through a transfer printing unit, conductive bodies are transferred from a conductor-forming mold to the pad-mounting surface so that the required electrical connection among the bonding pads and the corresponding ones of the solder points can be established.
Claims11
A semiconductor device adapted for mounting on a substrate, the substrate having a chip-mounting region provided with a plurality of solder points, said semiconductor device comprising:
- a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on said pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region;
- and
- a plurality of conductive bodies, each of which has an extension portion that is connected electrically to a respective one of said bonding pads, and an electrical connection portion that is formed on one end of said extension portion and that extends to a location corresponding to that of a respective one of the solder points on the chip-mounting region of the substrate, said conductive bodies being formed by:
- providing a conductor-forming mold having one side formed with a plurality of conductor-receiving cavities, each of said conductor-receiving cavities having a first cavity part that is disposed in said conductor-forming mold at a location corresponding to that of a respective one of said bonding pads on said pad-mounting surface, and a second cavity part that extends from said first cavity part and that is disposed in said conductor-forming mold at a location corresponding to that of a respective one of the solder points on the chip-mounting region of the substrate;
- filling said conductor-receiving cavities with a conductive metal paste to form said conductive bodies respectively therein, said extension portions of said conductive bodies being disposed in said first cavity parts of said conductor-receiving cavities, said electrical connection portions of said conductive bodies being disposed in said second cavity parts of said conductor-receiving cavities;
- and
- through a transfer printing unit, transferring said conductive bodies from said conductor-forming mold to said pad-mounting surface of said semiconductor chip.
Dependencies are inferred from the claim text.