Semiconductor device with gold bumps, and method and apparatus of producing the same
AssigneeFujitsu Limited
InventorsMasayuki Kitajima, Masakazu Takesue, Yoshitaka Muraoka
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Abstract
A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.
Claims8
A semiconductor device comprising a semiconductor element having electrodes, and metal bumps comprising gold bump elements and solder bump elements connected together, said gold bump elements being attached to the electrodes, said gold bump element substantially entirely contacting said electrode of said semiconductor element, said solder bump element resting on said gold bump element, said gold bump element and said solder bump element having thicknesses to define together a height of said metal bump, wherein said gold bump element has a flat surface with a recessed portion, and said solder bump element is fitted in said recessed portion.
A semiconductor device comprising a semiconductor element having electrodes, and metal bumps including gold bump elements provided on the electrodes of said semiconductor element and first metal layers formed around said gold bump elements, said first metal layers having a property for suppressing the diffusion of gold, said gold bump element and said first metal layer having thicknesses to define together a height of said metal bump.
Dependencies are inferred from the claim text.