Surface mount semiconductor diode device

A surface mount semiconductor diode device having first and second coplanar contacts, the device comprising:

• a semiconductor element having a first surface electrically mounted on a surface of a first member formed of conductive material, the first member having an arm which extends in a direction away from the surface of the first member, an end of the arm forming the first contact;
• and
• a cup member formed of conductive material and comprising a wall extending from a bottom portion so as to form an opening surrounded by the wall and having the bottom portion as a base,
• wherein the semiconductor element and first member are mounted within the opening such that a second surface of the semiconductor element is electrically coupled to the bottom portion of the cup member and the end of the arm extends above a top surface of the wall,
• wherein the cup member further comprises a lea portion integral with and extending from the top surface of the wall such that an end of the leg portion is coplanar with the end of the arm, the end of the leg portion forming the second contact, and wherein the main portion of the leg portion comprises a T-shaped member, a narrow end of the T-shaped member being connected to the wall and the two feet portions extending from a broad end of the T-shaped member.