Integrated circuit package having interchip bonding and method therefor
AssigneeMicrochip Technology Incorporated
InventorsSteve V. Drehobl, Joseph D. Fernandez, Mike Charles
Life of this patent
Estimating the term…
Abstract
An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.
Claims20
An integrated circuit package having the ability for interdevice communication comprising, in combination:
- a first device mounted within said integrated circuit package;
- a second device mounted within said integrated circuit package wherein said second device is directly coupled to said first device for allowing said first device and said second device to communicate with one another, wherein said first device and said second device are mounted on a platform;
- a die paddle for mounting said first device and said second device, wherein said die paddle has a pair of tie bars for coupling said die paddle to a lead frame;
- a plurality of lead fingers coupled to said first device and to said second device for allowing said first device and said second device to have connections external of said integrated circuit package;
- and
- lead frame coupled to said die paddle and said plurality of lead fingers for supporting said die paddle and said plurality of lead fingers.
An integrated circuit package having the ability for interdevice communication comprising
- a plurality of devices located within said integrated circuit package wherein at least one device of said plurality of devices is directly coupled to at least a second device of said plurality of devices for at least one of communicating and controlling of said at least a second device of said plurality of devices;
- a die paddle for mounting said plurality of devices, wherein said die paddle has a pair of tie bars for coupling said die paddle to said lead frame;
- a plurality of lead fingers coupled to each of said plurality of devices for allowing each of said plurality of devices to have connections external of said integrated circuit package;
- and
- a lead frame coupled to said die paddle and said plurality of lead fingers for supporting said die paddle and said plurality of lead fingers.
An integrated circuit package having the ability for interdevice communication comprising, in combination:
- a first device mounted within said integrated circuit package;
- a second device mounted within said integrated circuit package wherein said second device is directly coupled to said first device for allowing said first device and said second device to at least one of communicate and control one another;
- wherein said first device and said second device each have a plurality of bonding pads for allowing said first device and said second device to be connected to individual lead fingers;
- wherein said first device has a plurality of connector bonding pads wherein each connector bonding pad is directly coupled to an individual bonding pad of said first device and each connector bonding pad is further directly coupled to an individual bonding pad of said second device for allowing said first device to at least one of communicate and control said second device;
- a die paddle for mounting said first device and said second device wherein said die paddle has a pair of tie bars for coupling said die paddle to a lead frame;
- a plurality of lead fingers coupled to said first device and to said second device for allowing said first device and said second device to have connections external of said integrated circuit package;
- lead frame coupled to said die paddle and said plurality of lead fingers for supporting said die paddle and said plurality of lead fingers.
Dependencies are inferred from the claim text.