Integrated photo sensor
AssigneeDenso Corporation
InventorsInao Toyoda, Yoshitaka Gotoh
Life of this patent
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Abstract
A sensor portion of an integrated photo sensor is composed of a silicon substrate, a photo diode and a signal processing element which are provided on the silicon substrate separately from each other. A shading film is provided on a surface region of the substrate except a region above the photo diode, and an intermediate insulating film made of silicon oxide is provided between the silicon substrate and the shading film. The intermediate insulating film includes a part extending on a light-receiving region of the photo diode, and the part is covered with light transmittable gel having a refractive index approximately equal to that of the intermediate insulating film.
Claims16
An integrated photo sensor comprising:
- a chip;
- a light-receiving element provided on the chip for receiving light and converting an amount of the light into an electrical signal;
- a signal processing circuit element provided on the chip separately from the light-receiving element, for processing the electrical signal from the light-receiving element;
- a shading film provided on the chip to cover the signal processing circuit element and having a window corresponding to a light receiving region on the light-receiving element;
- an intermediate insulating film provided between the chip and the shading film, the intermediate insulating film extending on the signal processing circuit element and on the light-receiving element;
- and
- a light transmittable gel provided on the light-receiving element through the intermediate insulating film, the light transmittable gel having a refractive index approximately equal to that of the intermediate insulating film.
An integrated photo sensor comprising:
- a chip;
- a light-receiving element provided on the chip for receiving light and converting an amount of the light into an electrical signal;
- a signal processing circuit element provided on the chip separately from the light-receiving element, for processing the electrical signal from the light-receiving element;
- a shading film provided on the chip to cover a surface of the chip other than a light receiving region of the light-receiving element;
- an intermediate insulating film including a first part disposed on the signal processing circuit element between the chip and the shading film, and a second part disposed on the light receiving region of the light-receiving element;
- and
- a light transmittable gel provided on the light-receiving element through the intermediate insulating film, the light transmittable gel being thicker than the shading film and filling a step produced between the shading film and the second part of the intermediate insulating film.
Dependencies are inferred from the claim text.