Charge transfer device and a manufacturing process therefor
AssigneeNEC Corporation
InventorAkihito Tanabe
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AssigneeNEC Corporation
InventorAkihito Tanabe
Estimating the term…
This invention provides a manufacturing process for a charge transfer device comprising an N-type well formed in a P-type well on a semiconductor substrate for transferring a signal charge, an N+region formed on both sides along the charge transfer direction of the N-type well and containing a dopant in a higher concentration than that in the N-type well, a P-type region formed around the N+ region, and a gate electrode covering the N+ region and the N-type well and formed via a gate insulator, comprising ion-implanting an N-type dopant into the region to be the N-type well and the N+ region using the first mask and ion-implanting a P-type dopant into the region to be the N-type well using the second mask. Thus, there can be provided a charge transfer device which has a structure where there is an N+ region on both sides of the N-type well, a large maximum transferable charge and a compact CCD with a width up to 3 times the minimum design dimension.
A charge transfer device comprising a well of second conduction type for transferring a signal charge, formed in a well of first conduction type on a semiconductor substrate, first and second regions of second conduction type respectively formed directly on first and second sides in a horizontal direction along a charge transfer direction of the well of second conduction type and containing a dopant in a higher concentration than that in the well of second conduction type, first and second regions of first conduction type having different dopant concentrations and respectively formed around the first and second regions of second conduction type, and a gate electrode covering at least the well of second conduction type and the first and second regions of second conduction type and formed via a gate insulator,
A charge transfer device comprising a well of second conduction type formed for transferring a signal charge, in a well of first conduction type on a semiconductor substrate, first and second regions of second conduction type respectively formed directly on first and second sides in a horizontal direction along a charge transfer direction of the well of second conduction type and containing a dopant in a higher concentration than that in the well of second conduction type, first and second regions of first conduction type having different dopant concentrations and respectively formed around the first and second regions of second conduction type, and a gate electrode covering at least the well of second conduction type and the first and second regions of second conduction type and formed via a gate insulator,
Dependencies are inferred from the claim text.