Semiconductor apparatus process for production thereof and liquid crystal apparatus
AssigneeCanon Kabushiki Kaisha
InventorToru Nakazawa
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AssigneeCanon Kabushiki Kaisha
InventorToru Nakazawa
Estimating the term…
A semiconductor apparatus of the type includes a plurality of semiconductor devices arranged in a matrix and each having a principal electrode, an insulating layer coating the semiconductor devices, and a plurality of pixel electrodes (conductor film patterns) each disposed on the insulating film and connected to the principal electrode of semiconductor device through a contact hole formed in the insulating layer. Such a contact hole can be formed in a minute and accurate size allowing a high-definition pixel arrangement by forming the insulating layer in a laminate structure including first to third insulating layers formed in this order on the substrate, wherein the first and third insulating layers are patterned by etching while using the second insulating layer already provided with an aperture as an etching stopper layer to be provided with an aperture self-aligned with the aperture of the second insulating layer to define the contact hole (the first insulating layer) and into a desired planar shape surrounding the contact hole (the third insulating layer), respectively. The semiconductor apparatus is effectively incorporated in a reflection type liquid crystal display apparatus, suitably providing a projection-type display apparatus.
A semiconductor apparatus, comprising a semiconductor substrate, and a laminate structure formed on the semiconductor substrate including a principal electrode of semiconductor device, a laminate insulating layer and a conductor film disposed in this order on the semiconductor substrate, said principal electrode and said conductor film being electrically connected with each other through a contact hole formed within the laminate insulating layer,
A process for producing a semiconductor apparatus of the type comprising a semiconductor substrate, and a laminate structure formed on the semiconductor substrate including a principal electrode of semiconductor device, a laminate insulating layer and a conductor film disposed in this order on the semiconductor substrate, said principal electrode and said conductor film being electrically connected with each other through a contact hole formed within the laminate insulating layer;
Dependencies are inferred from the claim text.