Method of manufacturing circuit modules
AssigneeTaiyo Yuden Co., Ltd.
InventorMitsuo Ueno
Life of this patent
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Abstract
Circuit modules are made by melting solder on a land by irradiating the solder with a laser beam, and then pressing an external electrode of an electronic component to the melted solder before the melted solder hardens.
Claims23
A method of manufacturing a circuit module wherein an electrode of an electronic component is connected to an electrode of a substrate by way of a connecting material, comprising the steps of:
- melting a mass of connecting material preliminarily disposed on the electrode of the substrate by irradiating the mass with a laser beam;
- and
- then loading the electronic component on the substrate so as to press the electrode of the electronic component to the melted mass before the melted mass hardens.
A method of bonding an electrode of an electronic component to an electrode on a substrate with a mass of meltable material preliminarily disposed on the substrate electrode comprising the steps of melting the mass and then pressing the electrode of the component against the mass before the mass hardens.
Dependencies are inferred from the claim text.