Sheet metal component for double pattern conduction and printed circuit board
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorShinichi Nojioka
Life of this patent
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Abstract
A sheet metal component (8) for pattern conduction comprises a lead portion (8a) that is connected to an end portion of a first portion (8c1) of a ceiling portion (8c) by a coupling portion (8d) forming a first bend (R1); and a portion to be soldered (8b) that is bent inwardly from an end portion (8c2E, 8c3E) of a longitudinally protruding second portion (8c2, 8c3) of the ceiling portion (8c), which is connected to the first portion (8c1), so as to form a second bend (R2).
Claims5
A sheet metal component for double pattern conduction, for establishing connection between a first plane pattern and a second plane pattern provided on first and second planes of a printed circuit board, respectively, comprising:
- a lead portion;
- a coupling portion;
- a ceiling portion having a first portion and a second portion connected to said first portion;
- and
- a portion to be soldered, having a surface to be soldered which is parallel to said first plane and an end portion that can be soldered to said first plane pattern through said surface to be soldered,
- wherein said lead portion, said coupling portion, said ceiling portion, and said portion to be soldered are integrated;
- wherein said lead portion is shaped and sized to be inserted into a through hole passing through said printed circuit board, with its end portion protruding from said second plane;
- wherein said end portion of said lead portion is made of a material that can be soldered to said second plane pattern after said lead portion is inserted into said through hole;
- wherein said lead portion is connected to said first portion of said ceiling portion by said coupling portion that is bent inwardly in the middle to form a first bend;
- wherein said portion to be soldered is bent inwardly from an end portion of said second portion of said ceiling portion to form a second bend and further extends to face said second portion;
- and
- wherein a height from said ceiling portion to said portion to be soldered is greater than a height from said ceiling portion to said coupling portion.
A sheet metal component for double pattern conduction, for establishing connection between a first plane pattern and a second plane pattern provided on first and second planes of a printed circuit board, respectively, comprising:
- lead means;
- coupling means;
- ceiling means having a first portion and a second portion connected to said first portion;
- and
- means to be soldered, having a surface to be soldered which is parallel to said first plane and an end portion that can be soldered to said first plane pattern through said surface to be soldered,
- wherein said lead means, said coupling means, said ceiling means, and said means to be soldered are integrated;
- wherein said lead means can be inserted into a through hole passing through said printed circuit board, with its end portion protruding from said second plane;
- wherein said end portion of said lead means can be soldered to said second plane pattern after said lead means is inserted into said through hole;
- wherein said lead means is connected to said first portion of said ceiling means by said coupling means that is bend inwardly in the middle to form first bent means;
- wherein said means to be soldered is bend inwardly from an end portion of said second portion of said ceiling means to form second bent means and further extends to face said second portion;
- and
- wherein a height from said ceiling means to said means to be soldered is greater than a height from said ceiling means to said coupling means.
Dependencies are inferred from the claim text.