Ingot support device for slicing silicon
AssigneeA&A Material Corporation
InventorsHideki Honma, Katsuaki Kaneko
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Abstract
An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminium hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.
Claims6
An ingot support device for slicing silicon produced by molding a molding material comprising an acrylic resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate, and silica, wherein the ingot support device has a surface on which a an ingot is mounted on and secured to and the surface roughness of said surface is in the range between 10 and 1000 μm according to JIS B0601-1982.
An ingot support device for slicing silicon produced by molding a molding material comprising an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminium hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica wherein the ingot support device has a surface on which an ingot is mounted on and secured to and the surface roughness of said surface is in the range between 10 and 1000 μm according to JIS B0601-1982.
Dependencies are inferred from the claim text.