US 6,333,269 B2 · Plasma treatment system and method

Abstract

It is an object to enhance the degree of freedom for the shape of an obtained magnetic field to enhance the inplane uniformity of thickness of first and second films when the first and second films are continuously formed on a substrate to be treated. A main electromagnetic coil 5 is provided outside of a plasma chamber 21 so as to be movable vertically by a lifting shaft 52. When plasma is produced in a vacuum vessel 2 by the electron cyclotron resonance between a microwave and a magnetic field to continuously deposit a film of a two-layer structure, which comprises an SiOF film and an SiO2 film, on a wafer W with the produced plasma, a process for forming the SiOF film is carried out while the main electromagnetic coil 5 is arranged so that the lower surface of the coil 5 is positioned at a lower position than the lower surface of a transmission window 23 by 139 mm, and a process for forming the SiO2 film is carried out while the main electromagnetic coil 5 is arranged so that the lower surface of the coil 5 is positioned at a lower position than the lower surface of the transmission 23 by 157 mm.

Claims2

Dependent claims

A plasma treatment method for supplying a microwave into a vacuum vessel by high-frequency producing means and for forming a magnetic field in said vacuum vessel by magnetic field forming means, to produce plasma in said vacuum vessel by the electron cyclotron resonance between said microwave and said magnetic field to treat a substrate with the produced plasma, said plasma treatment method comprising:

a first step of introducing said substrate into said vacuum vessel and producing plasma to preheat said substrate before forming a thin film on said substrate;
and
a second step of activating a thin film deposition gas to produce plasma in said vacuum vessel and forming said thin film on said substrate with the produced plasma,
wherein the position of said magnetic field forming means is changed between positions in said first and second steps to change the shape of said magnetic field so that magnetic lines of force of said field converge on a central portion of said substrate during said first step to a greater extent than during said second step, and lines of force of said field are substantially more uniform over the plane of said substrate during said second step than during said first step.

1 more element

Dependencies are inferred from the claim text.

Plasma treatment system and method

Life of this patent

Plasma treatment system and method

Life of this patent

Abstract

Claims2