Pattern-block flux deposition
AssigneeAdvanced Micro Devices, Inc.
InventorsTerri J. Brownfield, Raj N. Master
Life of this patent
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Abstract
A method and apparatus are provided for selectively depositing flux on a plurality of flip-chip bumps arranged on a semiconductor by mounting a flux stamp on the semiconductor chip. The flux stamp has a plurality of flux holes arranged in a pattern substantially identically corresponding to the arrangement of the flip-chip bumps of the semiconductor chip. Different flux stamps are prepared for various kinds of semiconductor chips having different flip-chip bump arrangements. Flux is deposited though the flux holes of the flux stamp which selectively exposing the upper surfaces of the flip-chip bumps of the chip, thereby leaving no flux on the chip surface between the flip-chip bumps.
Claims10
A method for depositing flux on a semiconductor chip having a plurality of flip-chip bumps on its surface, the method comprising the steps of:
- masking the semiconductor chip to selectively expose the plurality of flip-chip bumps;
- and
- selectively depositing flux on the plurality of flip-chip bumps.
An apparatus for depositing flux on a semiconductor chip having a plurality of flip-chip bumps on its surface, the apparatus comprising:
- a flux stamp masking the surface of the semiconductor chip to selectively expose the plurality of flip-chip bumps;
- and
- a fluxer depositing flux on the exposed plurality of flip-chip bumps.
Dependencies are inferred from the claim text.