Low-pin-count chip package and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKyujin Jung, Kun-A Kang
Life of this patent
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Abstract
A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip. The semiconductor chip, the die pad, and the connection pads are encapsulated by a package body in a manner that the lower surfaces of the die pad and the connection pads are exposed through the package body. The present invention is characterized in that the die pad and the connection pads have a T-shaped profile thereby prolonging the time for moisture diffusion into the package as well as enhancing the “locking” of the die pad and the connection pads in the package body. The present invention further provides a method of producing the low-pin-count chip package described above.
Claims8
A method of making a low-pin-count chip package provided with a plurality of connection pads having a T-shaped profile, said method comprising the steps of
- providing a metal plate;
- forming a photoresist layer on the metal plate;
- photoimaging and developing the photoresist layer so as to form a pattern such that areas on the metal plate where the connection pads are to be formed are exposed from the photoresist layer;
- forming a protective metal flash on the exposed areas of the metal plate;
- overplating a layer of conductive material on the metal flash, using the patterned photoresist layer as a mask, so as to form the connection pads;
- forming a metal coating on the connection pads;
- stripping the photoresist layer from the metal plate;
- attaching a semiconductor chip onto the metal plate;
- electrically coupling the semiconductor chip to the connection pads located at the periphery of the chip;
- forming a package body over the semiconductor chip and the connection pads wherein the T-shaped profile helps to lock the connection pads in the package body;
- and
- removing the metal plate from the package body.
A method of making a low-pin-count chip package provided with a die pad and a plurality of connection pads having a T-shaped profile, said method comprising the steps of:
- providing a metal plate;
- forming a photoresist layer on the metal plate;
- photoimaging and developing the photoresist layer so as to form a pattern such that areas on the metal plate where the die pad and the connection pads are to be formed are exposed from the photoresist layer;
- forming a protective metal flash on the exposed areas of the metal plate;
- overplating a layer of conductive material on the metal flash so as to form the die pad and the connection pads;
- forming a metal coating on the die pad and the connection pads;
- stripping the photoresist layer from the metal plate;
- attaching a semiconductor chip onto the die pad;
- electrically coupling the semiconductor chip to the connection pads located at the periphery of the chip;
- forming a package body over the semiconductor chip and the connection pads wherein the T-shaped profile helps to lock the die pad and the connection pads in the package body;
- and
- removing the metal plate from the package body.
Dependencies are inferred from the claim text.