Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture
AssigneeInternational Business Machines Corporation
InventorsKenneth Raymond Carter, Richard Anthony Dipietro, Craig Jon Hawker, James Lupton Hedrick, Victor YeeWay Lee, Robert Dennis Miller, Willi Volksen, Do Yeung Yoon
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Abstract
The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.
Claims16
A process for forming an integrated circuit comprising:
- (a) positioning a layer of a dielectric composition, said dielectric composition comprising a decomposable polymer and an organic polysilica, said decomposable polymer having a three-dimensional star architecture, said decomposable polymer prepared by reacting a polyfunctional compound having at least three hydroxyfunctional groups with a cyclic ester wherein a star polymer having at least three arms is formed, on a substrate;
- (b) heating said composition to condense said polysilica;
- (c) decomposing said decomposable polymer;
- (d) lithographically patterning said dielectric layer;
- (e) depositing a metallic film onto said patterned dielectric layer;
- and
- (f) planarizing said metallic film to form an integrated circuit.
A process for forming an integrated circuit comprising:
- (a) depositing a metallic film on a substrate;
- (b) lithographically patterning said metallic film;
- (c) depositing a layer of a dielectric composition on said patterned metallic film, said dielectric composition comprising a decomposable polymer having a three-dimensional star architecture, said decomposable polymer prepared by reacting a polyfunctional compound having at least three hydroxyfunctional groups with a cyclic ester wherein a star polymer having at least three arms is formed, and an organic polysilica;
- (d) heating said dielectric composition to condense said polysilica;
- and
- (e) decomposing said decomposable polymer.
An insulative matrix material useful in microcircuit applications comprising a product obtained by heating a decomposable polymer having a three-dimensional star architecture, said decomposable polymer prepared by reacting a polyfunctional compound having at least three hydroxyfunctional groups with a cyclic ester wherein a star polymer having at least three arms is formed, and an organic polysilica polymer wherein said organic polysilica condenses and said decomposable polymer forms a plurality of discrete volumes surrounded by a condensed polysilica matrix.
Dependencies are inferred from the claim text.