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US 6,333,136 B1Granted
Carrier film and process for producing the same
AssigneeNEC Corporation
InventorsTadanori Shimoto, Koji Matsui
Life of this patent
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Abstract
The present invention provides a carrier film in which a cover resist layer made of epoxy acrylate resin including a fluorene skeleton is formed on a heat-resistant resin film including a conductive wiring pattern. The carrier film has heat resistance, moisture resistance, and close contact property, as well as chemical resistance in a plating process or the like, and does not warp because contraction in resin hardening is small.
Claims1
A process for producing a carrier film having
- a heat-resistant resin film including a conductive wiring pattern;
- and
- a cover resist layer made of epoxy acrylate resin including a fluorene skeleton and formed on said heat-resistant resin film, said process comprising:
- forming said cover resist layer made of epoxy acrylate resin including the fluorene skeleton by heating at temperature in a range of 180° C. to 260° C. for hardening.
1 more element
Dependencies are inferred from the claim text.