Method for controlling the texture and microstructure of plated copper and plated structure
AssigneeInternational Business Machines Corporation
InventorsPatrick William DeHaven, Peter S. Locke, Kenneth P Rodbell, Cyprian Emeka Uzoh
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Abstract
Copper is plated onto a substrate by plating a layer of copper onto the substrate to provide a maximum thickness of about 350 nanometers, followed by subjecting the copper coated substrate to an oxygen containing gaseous ambient in order to roughen the copper surface. Next, a second layer of copper is electroplated onto the structure to provide the desired thickness. The texture of the second layer of copper is independent of the underlayer of copper and has a random or at least substantially random texture.
Claims16
A method for plating copper onto a substrate which comprises plating a copper underlayer which comprises a layer of electroplated copper onto a substrate up to a maximum thickness of about 350 nanometers;
- subjecting the copper coated substrate to an oxygen-containing gaseous ambient for a time sufficient to roughen the surface of the copper;
- and
- then electroplating a second layer of copper to provide a thickness of at least about 200 nanometers.
Dependencies are inferred from the claim text.