Conductive polymer interconnection configurations
AssigneeInternational Business Machines Corporation
InventorsCharles H. Perry, Mark G. Courtney, Lewis s. Goldmann, Gregory B. Martin
Life of this patent
Estimating the term…
Abstract
Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a “card” using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.
Claims22
An interconnection for connecting two electrical components, comprising:
- a conductive polymer composition comprising a polymer component and an electrically conductive component;
- and,
- a first solderable cap disposed in contact with said conductive polymer composition;
- wherein said first solderable cap is a solder ball.
An interconnection for connecting two electrical components, comprising:
- a conductive polymer composition comprising a polymer component and an electrically conductive component;
- and a first solderable cap disposed in contact with said conductive polymer composition;
- wherein a plurality of projections are disposed in contact with said first solderable cap and extend into said conductive polymer.
An interconnection for connecting two electrical components, comprising:
- a conductive polymer composition comprising a polymer component and an electrically conductive component;
- a first solderable cap disposed in contact with said conductive polymer composition;
- and
- a second solderable cap disposed in contact with said conductive polymer opposite said first solderable cap;
- wherein a first plurality of projections are disposed in contact with said first solderable cap, a second plurality of projections are disposed in contact with said second solderable cap, and said first plurality of projections and said second plurality of projections extend into said conductive polymer.
Dependencies are inferred from the claim text.