Method for making molding parts using heat-curable molding compositions

A method of manufacturing a molded product comprising the steps of

• (a) covering with a heat-curable molding composition the outside of an electronic component that (1) can be heated and (2) has a coil formed by winding a conductive wire, said heat-curable molding composition comprising an unsaturated alkyd resin and a crosslinking monomer to be crosslinked to said unsaturated alkyd resin, said crosslinking monomer including (i) a first crosslinking monomer having each of an ethylenically unsaturated group, a carboxyl ground, and a hydroxyl group and being at least one of 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate and (ii) a second crosslinking monomers, said first crosslinking monomer being present in an amount of about 30 mol. % to 70 mol. % of the total of said crosslinking monomer,
• (b) feeding power to said electronic component to cause said coil to generate heat in said electronic component, and
• (c) curing said heat-curable molding composition by the heat generated by said electronic component causing a crosslinking reaction of said unsaturated alkyd resin, said first crosslinking monomer, and said second crosslinking monomer.

A method of manufacturing a molded product comprising the steps of

• (a) covering with a heat-curable molding composition the outside of an electronic component that (1) can be heated and (2) has a coil formed by winding a conductive wire, said heat-curable molding composition comprising an unsaturated alkyd resin and a crosslinking monomer to be crosslinked to said unsaturated alkyd resin, said crosslinking monomer including (i) a first crosslinking monomer having each of an ethylenically unsaturated group, a carboxyl ground, and a hydroxyl group and being at least one of 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate and (ii) a second crosslinking monomer, wherein said second crosslinking monomer includes styrene and the total of said first crosslinking monomer and said second crosslinking monomer is from about 90 mol. % to 100 mol. % of the total of said crosslinking monomer,
• (b) feeding power to said electronic component to cause said coil to generate heat in said electronic component, and
• (c) curing said heat-curable molding composition by the heat generated by said electronic component causing a crosslinking reaction of said unsaturated alkyd resin, said first crosslinking monomer, and said second crosslinking monomer.