Wiring method for a resin mold product
AssigneeYazaki Corporation
InventorsAtsuyoshi Yamaguchi, Mitsuaki Morimoto
Life of this patent
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Abstract
A resin mold product and a wiring method are provided. This resin mold product includes a main body formed into a pillar trim, side walls which are situated higher than wires, and wire receiving portions formed between the side walls. According to the wiring method: the wires, which have been cut to a suitable length for the front pillar, are received by the wire receiving portions; the side walls are partially melted so as to weld and secure the wires to the resin mold product; the resin mold product is mounted to the front pillar; and circuits mounted on the instrument panel and the roof are connected to each other.
Claims4
A wiring method for a resin mold product, comprising the steps of:
- providing a resin mold product having side walls facing each other;
- receiving wires at wire receiving portions formed between said side walls, said side walls having discrete protrusions which protrude from said side walls and are situated higher than said wires;
- and
- melting said discrete protrusions towards said wires to weld and secure said wires to the resin mold product.
Dependencies are inferred from the claim text.