Cup-type plating apparatus and method for plating wafer using the same
AssigneeElectroplating Engineers of Japan Limited
InventorsYasuhiko Sakaki, Mika Kurihara
Life of this patent
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Abstract
A cup-type plating apparatus includes a plating tank having a support section provided on an upper end thereof for holding a wafer; a solution feed section provided at the center of a bottom portion of the plating tank; an anode disposed within the plating tank; and a diaphragm for separating the anode from the wafer. The diaphragm is slanted upward from the solution feed section toward the periphery of the plating tank. A gas release port is provided in the plating tank at such a position as to release bubbles collected under an upper end portion of the diaphragm.
Claims3
A plating apparatus, comprising:
- a plating tank having a wafer support section provided on an upper end of said plating tank and adapted to hold a wafer;
- a solution feed section provided at the center of a bottom portion of said plating tank;
- an anode disposed within said plating tank;
- and
- a diaphragm for separating said anode from the wafer, said diaphragm being slanted upward from said solution feed section toward the periphery of said plating tank, said plating tank further having a gas release port provided at such a position as to release bubbles collected under an upper end portion of said diaphragm.
Dependencies are inferred from the claim text.