CMP polish pad and CMP processing apparatus using the same
AssigneeRohm Co., Ltd.
InventorKeisuke Suzuki
Life of this patent
Estimating the term…
Abstract
A CMP polish pad used to chemically and mechanically polish a work to be polished. The CMP polish pad has polishing portions of two or more types, that have different conditions of contact with the work, provided on the pad surface. For example, polishing portions of a plurality of types having different coefficients of elasticity with respect to compression in the direction of pressing against the work may be provided on the pad surface. Also polishing portions of a plurality of types having different areas of contact with the work may be provided on the pad surface. Further, polishing portions of a plurality of types having different heights above the pad surface may be provided on the pad surface.
Claims20
A CMP polish pad used to chemically and mechanically polish a work to be polished, comprising polishing portions of two or more types, having different conditions of contact with the work, provided on a pad surface.
A CMP processing apparatus, comprising:
- a holding mechanism that holds a work to be polished;
- a CMP polish pad having polishing portions of two or more types, that have different conditions of contact with the work held by the holding mechanism, provided on the pad surface;
- and
- a drive mechanism that is capable of changing the contact condition of the work with the CMP polish pad by moving the holding mechanism relative to the CMP pad, approaching thereto or departing therefrom.
Dependencies are inferred from the claim text.