Polishing method and polishing device
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsKouichi Okamura, Fumio Suzuki, Hisashi Masumura
Life of this patent
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Abstract
A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2).
Claims20
A polishing method comprising the steps of:
- supporting a turn table by a grooved surface of a turn table receiving member, the grooved surface being provided with a plurality of grooves in a straight direction;
- pressing a work against a polishing pad adhered to the turn table while flowing polishing slurry;
- and
- carrying out a polishing by rotating the work and the turn table.
A polishing apparatus comprising:
- a turn table to which a polishing pad is adhered;
- a turn table receiving member supporting the turn table by a grooved surface in which grooves are formed;
- a polishing slurry supplying unit for supplying polishing slurry to the polishing pad;
- and
- a rotating mechanism for rotating a work and the turn table,
- wherein the grooves are formed in the grooved surface of the receiving member in a straight direction.
Dependencies are inferred from the claim text.