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AssigneesShin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp.
InventorsFumihiko Hasegawa, Yasuyoshi Kuroka, Toshihiro Tsuchiya, Koichiro Ichikawa, Yasuo Inada
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A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.
A method of polishing a chamfer of a wafer having an orientation flat with a rotating buffing wheel pressed against the wafer chamfer by a predetermined pressure while rotating the wafer, wherein:
A method of polishing a chamfer of a wafer having an orientation flat with a rotating buffing wheel pressed against the wafer chamfer by a predetermined pressure, comprising the acts of:
Dependencies are inferred from the claim text.