Electrical connection device employing an anisotropic electrically conductive film
AssigneeSony Corporation
InventorsYasuhiro Suga, Noriyuki Honda
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Abstract
An anisotropic electrically conductive film which reduces a connection resistance value in electrical connection to assure reliable electric connection, and an electrical connecting device employing this anisotropic electrically conductive film. To this end, metal coated particles having a resin (40) as a core material are dispersed in an insulating adhesive (8) to give an anisotropic electrically eonductive film. The resin (40) of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 Å.
Claims17
An anisotropic electrically conductive film in which metal coated particles having a resin as a core material are dispersed in an insulating adhesive, wherein said resin of the metal coated particles is coated with metal. that is formed of at least one layer, said metal having a total thickness of 1000 to 3000 Å.
An electrical connection device which, for electrically connecting first and second objects, employs an anisotropic electrically conductive film in which metal coated particles having a resin as a core material are dispersed in an insulating adhesive, wherein said resin of the metal coated particles is coated with metal that is formed of at least one layer, said metal having a total thickness of 1000 to 3000 Å.
An anisotropic electrically conductive film, comprising:
- a filmed adhesive layer containing electrically conductive particles and a binder that includes a resin, wherein the electrically conductive particles are coated with Ni and Au, and supported by said binder functioning as an insulating adhesive for said particles.
Dependencies are inferred from the claim text.