Spatial transformation interposer for electronic packaging

An interconnect substrate structure for electrical interconnection between two electronic modules having differing conductive array parameters comprising:

• an interposer having a top surface and a bottom surface;
• a first set of conductive arrays having a first conductive array parameter on said top surface,
• a second set of conductive arrays having a second conductive array parameter on said bottom surface, said second conductive array and said first conductive array having differing conductive array parameters selected from the group consisting of differing array shape, array size, type of array, and combinations thereof;
• a plurality of conductors traversing a thickness of said interposer, said conductors comprising at least a conductive material surrounded by a non-conductive material, said conductors having a first end at said first conductive arrays and a second end at said second conductive arrays, whereby said non-conductive material of said conductors has a radial thickness changing as said conductors traverse through said interposer to connect said first and second conductive arrays by spatially transforming the differing conductive array parameters of said first and second conductive array grids for providing an electrical interconnection therebetween;
• and
• a matrix surrounding said conductors,
• whereby said interposer having said non-conductive material with said radial thickness changing there-through said interposer spatially transforms said differing conductive array parameters of said two electronic modules to electrically connect the electronic modules when provided therebetween.

A method of fabricating an interconnect substrate for electrically connecting two electronic modules having differing conductive array parameters comprising:

• forming an interposer having first and second conductive array grids on first and second surfaces of said interposer respectively, said first and second conductive array grids have differing conductive array parameters selected from the group consisting of differing array shape, array size, type of array, and combinations thereof;
• providing said interposer with a plurality of conductors comprising at least a conductive material surrounded by a non-conductive material, said conductors traversing a thickness of said interposer whereby said non-conductive material has a radial thickness changing as said conductors traverses through said interposer to spatially transform said differing conductive array parameters by connecting a first conductive array parameter of the first conductive array grid on the first surface of said interposer to the opposing, differing second conductive array parameter of the second conductive array grid on the second surface of said interposer for providing an electrical interconnection therebetween,
• whereby said interposer having said non-conductive material with said radial thickness changing there-through said interposer spatially transforms the differing conductive array parameters of the two electronic modules to electrically connect the electronic modules having differing conductive array parameters when provided therebetween.

A method of fabricating an electronic assembly having an interconnect substrate for electrically connecting two electronic modules comprising:

• providing first and second electronic modules having differing first and second conductive array parameters respectively, wherein said differing first and second conductive array parameters of said first and second electronic modules are selected from the group consisting of differing array shape, array size, type of array, and combinations thereof;
• determining a spatial transformation between said differing first and second conductive arrays parameters of said first and second electronic modules;
• forming an interposer having a top surface and a bottom surface, said top surface of said interposer being provided with a first set of conductive arrays having a conductive array parameter corresponding to said first conductive array parameter of said first electronic module while said bottom surface of said interposer is provided with a second set of conductive arrays having a conductive array parameter corresponding to said second conductive array parameter of said second electronic module, said second conductive array and said first conductive array of said interposer having differing parameters;
• spatially transforming said first and second conductive arrays of said interposer by providing a plurality of conductors traversing a thickness of said interposer, said conductors comprising at least a conductive material surrounded by a dielectric material, said conductors having a first end at said first conductive arrays and a second end at said second conductive arrays, whereby said dielectric material has a radial thickness changing as said conductors traverse through said interposer to connect said first and second conductive arrays of said interposer thereby spatially transforming said first and second conductive arrays parameters of said first and second electronic modules based on said determined spatial transformation to provide an electrical interconnection therebetween said first and second electronic modules;
• and
• providing a matrix surrounding said plurality of conductors.