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AssigneeHitachi, Ltd.
InventorsMakoto Shimaoka, Tadaaki Ishikawa, Kazuyuki Fukuda, Katsumi Kuroguchi
Estimating the term…
When an optical system is housed in a plastic case, an optical connection in the system might be changed by a deformation of the case due to heat and thermal resistance might be increased. It is important that the case has not only a function of housing the elements of the optical system, but also a function of ensuring that light is stably produced in the optical system, which, is the most important function of the case. Therefore, the deformation of the case due to a change in temperature is prevented by a frame inserted into the opening portion of the case and further by mounting the case on an external aluminum substrate. That is, stability in the optical connection is improved by improving the structure of the case and by mounting an case on the external substrate. Further, an increase in the thermal resistance is prevented in the same way by provision of the frame and the external aluminum substrate.
A semiconductor laser coupling device comprising a semiconductor laser element or a semiconductor light receiving element, an optical fiber optically coupled to the semiconductor laser element or the semiconductor light receiving element, a substrate on which said semiconductor laser element or said semiconductor light receiving element and said optical fiber are mounted, and a case for receiving said substrate, wherein said case has a plurality of side walls, and a heat-dissipating member is arranged in the bottom of said case and a reinforcing member extends along at least two side walls of said case.
A method of mounting on a circuit board a semiconductor laser coupling device comprising a semiconductor laser element or a semiconductor light receiving element, an optical fiber optically coupled to the semiconductor laser element or the semiconductor light receiving element, a semiconductor laser coupling device substrate on which the semiconductor laser element or the semiconductor light receiving element and the optical fiber are mounted, and a case for receiving the substrate, said method comprising the steps of:
A semiconducting laser coupling device comprising a semiconductor laser element or a semiconductor light receiving element, an optical fiber optically coupled to said semiconductor laser element or said semiconductor light receiving element, a substrate for mounting thereon said semiconductor laser element or said semiconductor light receiving element in said optical fiber and a case for receiving said substrate, said case having a plurality of side walls and having a heat-dissipating member arranged in a bottom of said case, and a reinforcing member which suppresses deformation of said case extending along at least one side wall of said case.
Dependencies are inferred from the claim text.